METHOD OF CARRYING SUBSTRATE

WIPO Patent Application WO/2003/073495

A1

A method of carrying a substrate capable of carrying even a thinned substrate while maintaining a flatness and preventing particles from adhering to the substrate, comprising the steps of installing a third substrate holding mechanism on the substrate by a carrying device in the state of a first substrate holding mechanism holding the substrate, holding the substrate in the carrying device by driving the third substrate holding mechanism in the state of a first base stand holding the substrate, releasing the holding of the substrate by the first substrate holding mechanism, and jetting fluid from a first fluid jetting mechanism, carrying the substrate from the first base stand to a second base stand and installing the substrate in the second substrate holding mechanism, and holding the substrate on the second base stand by driving the second substrate holding mechanism in the state of the third base stand holding the substrate, jetting fluid from the second fluid jetting mechanism, and releasing the holding of the substrate by the third substrate holding mechanism.

YUASA MITSUHIRO (JP)
HOMMA KOJI (JP)

PCT/JP2002/013680

September 04, 2003

December 26, 2002

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TOKYO ELECTRON LTD (JP)
YUASA MITSUHIRO (JP)
HOMMA KOJI (JP)

H01L21/677; H01L21/683; H01L21/687; H02N13/00; (IPC1-7): H01L21/68; H01L21/304; H02N13/00

JP2001284434A	2001-10-12
JPH0410452A	1992-01-14
JPH1174182A	1999-03-16
JPH09295236A	1997-11-18
JPH03155647A	1991-07-03
JPH11254317A	1999-09-21
JPH10270539A	1998-10-09
US20010021571A1	2001-09-13

Itoh, Tadahiko (Yebisu Garden Place Tower 20-3, Ebisu 4-chom, Shibuya-ku Tokyo, JP)

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