Title:
METHOD FOR CHAMFERING WAFER
Document Type and Number:
WIPO Patent Application WO/2010/119765
Kind Code:
A1
Abstract:
Though in conventional wafer chamfering, the chamfered shape (cross-sectional shape) of the wafer circumference is uniform, in a chamfering step in wafer manufacture, the uniform chamfered shape varies by the position on the circumference. Provided is a wafer chamfering method wherein deformation in the chamfering step in the wafer manufacture is taken into account.
In the chamfering method, a grindstone without a groove is brought into contact with the edge (circumferential end portion) of the wafer, and the wafer is chamfered. The wafer and the grindstone are relatively moved in the Z axis direction and the Y axis direction, and a moving track which forms the same cross-sectional shape on the entire wafer circumference is set as a reference. For the chamfering operation wherein the relative positions of the wafer and the grindstone are changed from the reference track position to the Z axis direction and/or the Y axis direction corresponding to the wafer rotation angle positions, a piezoelectric actuator is used and different cross-sectional shapes corresponding to the wafer rotation angle positions are formed.
Inventors:
ISHIMASA Yukio (Machida Techno Park, 2-5-6, Oyamagaoka 2-chome, Machida-sh, Tokyo 15, 〒1940215, JP)
石政 幸男 (〒15 東京都町田市小山ケ丘二丁目２番５－６ まちだテクノパーク ダイトエレクトロン株式会社内 Tokyo, 〒1940215, JP)
KATAYAMA Ichiro (Machida Techno Park, 2-5-6, Oyamagaoka 2-chome, Machida-sh, Tokyo 15, 〒1940215, JP)
片山 一郎 (〒15 東京都町田市小山ケ丘二丁目２番５－６ まちだテクノパーク ダイトエレクトロン株式会社内 Tokyo, 〒1940215, JP)
石政 幸男 (〒15 東京都町田市小山ケ丘二丁目２番５－６ まちだテクノパーク ダイトエレクトロン株式会社内 Tokyo, 〒1940215, JP)
KATAYAMA Ichiro (Machida Techno Park, 2-5-6, Oyamagaoka 2-chome, Machida-sh, Tokyo 15, 〒1940215, JP)
片山 一郎 (〒15 東京都町田市小山ケ丘二丁目２番５－６ まちだテクノパーク ダイトエレクトロン株式会社内 Tokyo, 〒1940215, JP)
Application Number:
JP2010/055683
Publication Date:
October 21, 2010
Filing Date:
March 30, 2010
Export Citation:
Assignee:
DAITO ELECTRON CO., LTD. (6-11, Miyahara 4-chome Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
ダイトエレクトロン株式会社 (〒03 大阪府大阪市淀川区宮原４丁目６番１１号 Osaka, 〒5320003, JP)
SHIN-ETSU HANDOTAI CO., LTD. (6-2 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町２丁目６番２号 Tokyo, 〒1000004, JP)
ISHIMASA Yukio (Machida Techno Park, 2-5-6, Oyamagaoka 2-chome, Machida-sh, Tokyo 15, 〒1940215, JP)
石政 幸男 (〒15 東京都町田市小山ケ丘二丁目２番５－６ まちだテクノパーク ダイトエレクトロン株式会社内 Tokyo, 〒1940215, JP)
ダイトエレクトロン株式会社 (〒03 大阪府大阪市淀川区宮原４丁目６番１１号 Osaka, 〒5320003, JP)
SHIN-ETSU HANDOTAI CO., LTD. (6-2 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町２丁目６番２号 Tokyo, 〒1000004, JP)
ISHIMASA Yukio (Machida Techno Park, 2-5-6, Oyamagaoka 2-chome, Machida-sh, Tokyo 15, 〒1940215, JP)
石政 幸男 (〒15 東京都町田市小山ケ丘二丁目２番５－６ まちだテクノパーク ダイトエレクトロン株式会社内 Tokyo, 〒1940215, JP)
International Classes:
B24B9/00; B24B1/00; B24B17/04; H01L21/304
Attorney, Agent or Firm:
DOBASHI Akira (Urban Toranomon Building, 16-4 Toranomon 1-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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