Title:
METHOD FOR CLEANING ABRASIVE CLOTH AND METHOD FOR POLISHING WAFER
Document Type and Number:
WIPO Patent Application WO/2015/049829
Kind Code:
A1
Abstract:
A method which comprises supplying a cleaning fluid to the surface of an abrasive cloth for polishing a wafer and thereby cleaning the abrasive cloth, characterized by cleaning the abrasive cloth for eight or more hours while supplying an aqueous sodium hydroxide or potassium hydroxide solution as the cleaning fluid to the surface of the abrasive cloth. Thus, provided are: an abrasive cloth cleaning method which can effectively clean an abrasive cloth and thus minimize the microscratches that occur on the surface of a polished wafer and that is associated with an increase in the operating time of the abrasive cloth and which makes it possible to use the abrasive cloth for a longer time; and a wafer polishing method.
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Inventors:
SASAKI TAKUYA (JP)
Application Number:
PCT/JP2014/004492
Publication Date:
April 09, 2015
Filing Date:
September 02, 2014
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B37/00; B24B37/04; B24B53/007; H01L21/304
Foreign References:
| JPH11262854A | 1999-09-28 | |||
| JP2006032694A | 2006-02-02 | |||
| JP2007036261A | 2007-02-08 | |||
| JP2002134458A | 2002-05-10 | |||
| JP2004106360A | 2004-04-08 | |||
| US6155912A | 2000-12-05 | |||
| JP2002270555A | 2002-09-20 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
Good Miya Mikio (JP)
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