Title:
METHOD FOR CLEANING ARTICLE EMPLOYING ULTRASONIC WAVE
Document Type and Number:
WIPO Patent Application WO/2011/030917
Kind Code:
A1
Abstract:
Provided is a method for cleaning and sterilizing powerfully a surface of an article by use of an ultrasonic wave to remove oil and dirt adhering to the surface of the article. The method enables reduction of the cost of the installation and running of the apparatus for the continuous cleaning and sterilization. The apparatus has a pair of ultrasonic oscillators (4) arranged one above the other with the oscillating faces thereof counterposed below the water surface in a cleaning vessel (2) which holds cleaning-water (W) containing dissolved oxygen and nitrogen at high concentrations. A portion of the cleaning water containing dissolved oxygen and nitrogen at high concentrations is introduced into a narrow interspace region (7) between the oscillating faces of the ultrasonic oscillators at a flow rate of about 50 cm/min with the amount and rate of the water flow controlled by a baffle plate (8). The side wall of the cleaning vessel (2) has an opening, through which a delivery conveyor (3) is installed for delivering a cleaning object (A). The cleaning water is allowed to flow out through the opening. The cleaning water to be fed to the cleaning vessel (2) is ejected into the inside of the opening to form a water curtain (Wa) to decrease the flow-out of a large amount of the water from the opening. The cleaning water falling from the opening is received by a water-receiving vessel (1) placed below, and pumped to a cleaning vessel (2) by a pump and cyclically used.
Inventors:
HIRAKAWA, Yoshihiro (79-8, Toshakuhei Arita-mach, Nishimatsuura-gun Saga 17, 8440017, JP)
Application Number:
JP2010/065993
Publication Date:
March 17, 2011
Filing Date:
September 09, 2010
Export Citation:
Assignee:
HIRAKAWA, Yoshihiro (79-8, Toshakuhei Arita-mach, Nishimatsuura-gun Saga 17, 8440017, JP)
International Classes:
B08B3/12; A61B19/00; A61L2/18; C23G1/00; H01L21/304
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg.5-1, Toranomon 3-chom, Minato-ku Tokyo 23, 〒1058423, JP)
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