Title:
METHOD FOR CLEANING SEMICONDUCTOR WAFERS
Document Type and Number:
WIPO Patent Application WO/2019/095126
Kind Code:
A1
Abstract:
A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.
Inventors:
WANG HUI (CN)
CHEN FUFA (CN)
CHEN FUPING (CN)
WANG JIAN (CN)
WANG XI (CN)
ZHANG XIAOYAN (CN)
JIN YINUO (CN)
JIA ZHAOWEI (CN)
XIE LIANGZHI (CN)
WANG JUN (CN)
LI XUEJUN (CN)
CHEN FUFA (CN)
CHEN FUPING (CN)
WANG JIAN (CN)
WANG XI (CN)
ZHANG XIAOYAN (CN)
JIN YINUO (CN)
JIA ZHAOWEI (CN)
XIE LIANGZHI (CN)
WANG JUN (CN)
LI XUEJUN (CN)
Application Number:
PCT/CN2017/111015
Publication Date:
May 23, 2019
Filing Date:
November 15, 2017
Export Citation:
Assignee:
ACM RES SHANGHAI INC (CN)
International Classes:
B08B3/12; H01L21/67
Domestic Patent References:
| WO2016183811A1 | 2016-11-24 |
Foreign References:
| US20060260638A1 | 2006-11-23 | |||
| US6557564B1 | 2003-05-06 | |||
| CN101879511A | 2010-11-10 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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