METHOD OF CLEANING SUBSTRATES

Title:

METHOD OF CLEANING SUBSTRATES

Document Type and Number:

WIPO Patent Application WO/1996/021942

Kind Code:

A1

Abstract:

A method of removing particles adherent to substrates, in particular, silicon wafer substrates by cleaning with an ammonia-hydrogen peroxide solution mixture, rinsing with ultrapure water, cleaning with hydrofluoric acid, and rinsing with ultrapure water, wherein an anionic surfactant is added to the hydrofluoric acid and, if necessary, to the ammonia-hydrogen peroxide solution mixture. As the particles detached in the step of cleaning with an ammonia-hydrogen peroxide solution mixture are not absorbed again in the step of cleaning with hydrofluoric acid, the particle removal rate is remarkably improved.

Inventors:

ITANO MITSUSHI (JP)
KEZUKA TAKEHIKO (JP)
SUYAMA MAKOTO (JP)

Application Number:

PCT/JP1996/000028

Publication Date:

July 18, 1996

Filing Date:

January 11, 1996

Export Citation:

Click for automatic bibliography generation Help

Assignee:

DAIKIN IND LTD (JP)
ITANO MITSUSHI (JP)
KEZUKA TAKEHIKO (JP)
SUYAMA MAKOTO (JP)

International Classes:

B08B3/08; C11D3/04; C11D3/395; C23F1/16; C23G1/02; H01L21/304; H01L21/306; (IPC1-7): H01L21/304

Foreign References:

JPH06177101A	1994-06-24
JPH0641770A	1994-02-15
JPH06236867A	1994-08-23

Other References: