METHOD FOR COATING ELECTRONIC PARTS

WIPO Patent Application WO/2002/043136

A1

A method for coating an electronic part having an electrode projecting upward, which comprises coating the major portion except said electrode of the electronic part with a hydrosilylation curing type silicone rubber composition comprising (A) an organopolysiloxane having at least two alkenyl groups bonded to a silicon atom in a molecule, (B) an organopolysiloxane having at least two hydrogen atoms bonded to a silicon atom in a molecule and having a content of said hydrogen atom bonded to a silicon atom of 0.9 wt % or more, and (C) a platinum-based catalyst, heating the electronic part under a condition which causes no curing of said composition in the form of a thin film, to thereby cure only said composition covering said major portion, and then washing the part with a solvent. The method for coating can be used for preventing an electrode from being soiled by a liquid curable resin and thus avoiding a soldering failure in the subsequent soldering step.

YAMAKAWA KIMIO (JP)
NAKANISHI JUNJI (JP)
ISSHIKI MINORU (JP)
KATO TOMOKO (JP)
MINE KATSUTOSHI (JP)

PCT/JP2001/009870

May 30, 2002

November 12, 2001

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DOW CORNING TORAY SILICONE (JP)
YAMAKAWA KIMIO (JP)
NAKANISHI JUNJI (JP)
ISSHIKI MINORU (JP)
KATO TOMOKO (JP)
MINE KATSUTOSHI (JP)

B05D7/00; C09D183/04; C09J183/05; C09J183/07; H01L23/29; H01L23/31; (IPC1-7): H01L21/56; C09J183/05; C09J183/07; H01L23/28

EP0757080A2	1997-02-05
JP2000080335A	2000-03-21
JP2000119627A	2000-04-25
JPH1112546A	1999-01-19

Soga, Michiteru (Kokusai Building 1-1 Marunouchi 3-chome Chiyoda-ku, Tokyo, JP)

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