Title:
METHOD FOR COATING A SUBSTRATE HAVING HOLES
Document Type and Number:
WIPO Patent Application WO2003059531
Kind Code:
A3
Abstract:
Prior art coating methods have the following drawback in that the dimensions of existing holes in the substrate are altered when coating them thereby limiting the function and effect of the hole and of the substrate. The inventive method for coating a substrate (1) having holes (4) makes it possible for holes (4) to retain their dimensions due to the fact that they are protected by a stopper (16).
Inventors:
JEUTTER ANDRE (DE)
STAMM WERNER (DE)
STAMM WERNER (DE)
Application Number:
PCT/EP2002/014500
Publication Date:
August 19, 2004
Filing Date:
December 18, 2002
Export Citation:
Assignee:
SIEMENS AG (DE)
JEUTTER ANDRE (DE)
STAMM WERNER (DE)
JEUTTER ANDRE (DE)
STAMM WERNER (DE)
International Classes:
B05D1/32; B05D3/06; C23C4/01; C23C30/00; C25D5/02; (IPC1-7): B05D1/32; B05D3/06
Foreign References:
| EP1076107A1 | 2001-02-14 | |||
| US6335078B2 | 2002-01-01 | |||
| US5328723A | 1994-07-12 |
Other References:
DATABASE WPI Section Ch Week 199402, Derwent World Patents Index; Class A88, AN 1994-014562, XP002223347
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