Title:
METHOD FOR COMPRESSION MOLDING ELECTRIC COMPONENT AND COMPRESSION MOLDING APPARATUS FOR USE IN THE METHOD
Document Type and Number:
WIPO Patent Application WO/2008/053734
Kind Code:
A1
Abstract:
A horizontal nozzle (23) is first inserted in a horizontally extended state into
between an upper mold (6) and a lower mold (7).A liquid resin (4) is then delivered
in a horizontal direction through a delivery port (29) in the horizontal nozzle
(23) and thus is supplied into a cavity (10). Thereafter, the mold assembly of
the upper mold (6) and the lower mold (7) is closed. As a result, an electric component
(2) mounted on a substrate (1) is immersed in the liquid resin (4) in the cavity
(10), and, thus, the electric component (2) is resin sealed on the substrate (1)
by compression molding.
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Inventors:
YAMADA, Tetsuya (5 Kamitoba Kamichoshi-cho,Minami-ku, Kyoto-sh, Kyoto 05, 6018105, JP)
山田 哲也 (〒05 京都府京都市南区上鳥羽上調子町５番地 ＴＯＷＡ株式会社内 Kyoto, 6018105, JP)
山田 哲也 (〒05 京都府京都市南区上鳥羽上調子町５番地 ＴＯＷＡ株式会社内 Kyoto, 6018105, JP)
Application Number:
JP2007/070542
Publication Date:
May 08, 2008
Filing Date:
October 22, 2007
Export Citation:
Assignee:
TOWA CORPORATION (5 Kamitoba Kamichoshi-cho, Minami-ku Kyoto-sh, Kyoto 05, 6018105, JP)
ＴＯＷＡ株式会社 (〒05 京都府京都市南区上鳥羽上調子町５番地 Kyoto, 6018105, JP)
YAMADA, Tetsuya (5 Kamitoba Kamichoshi-cho,Minami-ku, Kyoto-sh, Kyoto 05, 6018105, JP)
ＴＯＷＡ株式会社 (〒05 京都府京都市南区上鳥羽上調子町５番地 Kyoto, 6018105, JP)
YAMADA, Tetsuya (5 Kamitoba Kamichoshi-cho,Minami-ku, Kyoto-sh, Kyoto 05, 6018105, JP)
International Classes:
B29C43/34; B29C33/68; B29C43/18; H01L21/56; H01L33/00
Attorney, Agent or Firm:
FUKAMI, Hisao et al. (Fukami Patent Office, Nakanoshima Central Tower 22nd Floor,2-7, Nakanoshima 2-chome,Kita-ku, Osaka-sh, Osaka 05, 5300005, JP)
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