Title:
METHOD FOR CONNECTING ELECTRONIC PART AND CONNECTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2012/057227
Kind Code:
A1
Abstract:
Provided are a method for connecting electronic parts and a connecting structure that make the obtainment of high connection reliability possible. An anisotropic conductive film (20) is provisionally installed prior to thermal compression bonding so that: the border (16) between a circuit protection area (14) and a terminal area (15) of a second electronic part (12) is positioned on a single layer area (23) of the anisotropic conductive film (20); and the terminal area (15) of the second electronic part (12) is positioned on a double layer area (24) of the anisotropic conductive film (20).
Inventors:
TSUKAO REIJI (JP)
ISHIMATSU TOMOYUKI (JP)
OZEKI HIROKI (JP)
ISHIMATSU TOMOYUKI (JP)
OZEKI HIROKI (JP)
Application Number:
PCT/JP2011/074718
Publication Date:
May 03, 2012
Filing Date:
October 26, 2011
Export Citation:
Assignee:
SONY CHEM & INF DEVICE CORP (JP)
TSUKAO REIJI (JP)
ISHIMATSU TOMOYUKI (JP)
OZEKI HIROKI (JP)
TSUKAO REIJI (JP)
ISHIMATSU TOMOYUKI (JP)
OZEKI HIROKI (JP)
International Classes:
H01R11/01; H01B5/14; H01B5/16; H01B13/00; H05K1/14
Domestic Patent References:
| WO2006093315A1 | 2006-09-08 | |||
| WO2008029580A1 | 2008-03-13 | |||
| WO2009078409A1 | 2009-06-25 |
Foreign References:
| JPS63310581A | 1988-12-19 | |||
| JPH08279371A | 1996-10-22 | |||
| JP2007182062A | 2007-07-19 |
Attorney, Agent or Firm:
KOIKE, Akira et al. (JP)
Akira Koike (JP)
Akira Koike (JP)
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Claims:
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