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Title:
METHOD, CONTROL SYSTEM AND INSTALLATION FOR PROCESSING A SEMICONDUCTOR WAFER, AND SEMICONDUCTOR WAFER
Document Type and Number:
WIPO Patent Application WO/2018/234030
Kind Code:
A3
Abstract:
The invention relates to a method for processing a semiconductor wafer (600), comprising three processing steps, namely a first polishing step, in which the semiconductor wafer (600) is double-side polished, subsequently a second polishing step, in which the semiconductor wafer (600) is polished chemically and mechanically, and then a coating step, in which a layer is epitaxially deposited on the semiconductor wafer (600). The invention further relates to a control system for carrying out said method, an installation for processing a semiconductor wafer and comprising said control system, and a semiconductor wafer. The method is characterized in that at least one processing step-related operating parameter is defined for each of the three processing steps, based on at least one wafer parameter that is determined on the semiconductor wafer to be processed; based on an actual state of a processing apparatus used to carry out the respective processing step; and based on an optimization of wafer parameters that characterize evenness with respect to the evenness status after undergoing the three processing steps instead of an optimization of said wafer parameters with respect to the evenness status after each of the three processing steps.

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Inventors:
WELSCH STEFAN (DE)
WEBER CHRISTOF (DE)
BEYER AXEL (DE)
Application Number:
PCT/EP2018/064735
Publication Date:
April 04, 2019
Filing Date:
June 05, 2018
Export Citation:
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Assignee:
SILTRONIC AG (DE)
International Classes:
H01L21/02; B24B27/00; B24B37/005; B24B37/04; B24B37/08; B24B37/10; B24B49/04; B24B51/00; C30B25/02; C30B29/06
Foreign References:
US20080036040A12008-02-14
US20090269861A12009-10-29
DE102008045534A12010-03-11
DE102007021729B32008-10-09
DE102015224933A12017-06-14
DE102005045339A12007-04-05
Attorney, Agent or Firm:
STAUDACHER, Wolfgang (DE)
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