Title:
METHOD FOR CONTROLLING BOAT/STRIP TYPE SOLDER BALL PLACEMENT SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/256656
Kind Code:
A1
Abstract:
The present invention relates to a method for controlling a boat/strip type solder ball placement system and, more specifically, enables both a boat carrier type solder ball mounting process and a substrate strip type solder ball mounting process in one system. Particularly, the present invention enables the two types of solder ball mounting process to be carried out quickly and accurately by automatically adjusting the configuration of the system, the operation settings or the like in accordance with the type of material onloaded to a magazine. Also, the present invention enables the two different types of process to be carried out in one system by combining, into one configuration, a configuration applied only to a boat carrier type and a configuration applied only to a substrate strip type in a process for mounting a solder ball to an onloaded material. Therefore, reliability and competitiveness can be improved in the semiconductor field, semiconductor package manufacturing field, PCB manufacturing field, particularly, wafer level chip scale package (WLCSP)-based manufacturing field, solder ball placement system field as well as fields similar or related thereto.
Inventors:
LEE KYOUHO (KR)
Application Number:
PCT/KR2021/001937
Publication Date:
December 23, 2021
Filing Date:
February 16, 2021
Export Citation:
Assignee:
SSP INC (KR)
International Classes:
H01L21/48; B23K3/06; H01L21/67
Foreign References:
| KR20070050007A | 2007-05-14 | |||
| KR100998255B1 | 2010-12-03 | |||
| KR20110034768A | 2011-04-06 | |||
| KR20110034769A | 2011-04-06 | |||
| KR100531230B1 | 2005-11-29 | |||
| KR102206226B1 | 2021-01-22 |
Attorney, Agent or Firm:
JUNG, Doo Seung (KR)
Download PDF: