Title:
METHOD OF COOLING STEEL SHEET
Document Type and Number:
WIPO Patent Application WO/2008/020549
Kind Code:
A1
Abstract:
A method of cooling a steel sheet, in which improved uniform cooling in the direction
of steel sheet conveyance can be attained. The method is characterized by the
following. In anterior section (4a) of cooling unit, during the passage of distal
end region (11) of steel sheet, the cooling water rate is set to noninjection
of water. At the passage of distal part region (12), the cooling water
rate is gradually increased from 80 to 95 vol.% (Qiront) of standard
water rate density (Qo). At the arrival of the boundary between distal part region
and middle part region, water injection is conducted so that the cooling water
rate agrees with the standard water rate density. During the passage of the middle
part region, water injection is continued at the standard water rate density.
In posterior section (4b) of the cooling unit, during the passage of the distal
end region of the steel sheet, the cooling water rate is set to 80 to 95 vol.% of the
standard water rate density. At the passage of the distal part region, the cooling
water rate is gradually increased from 80 to 95 vol.% of standard water rate density.
At the arrival of the boundary between distal part region and middle part region,
water injection is conducted so that the cooling water rate agrees with the standard
water rate density. During the passage of the middle part region, water injection
is continued at the standard water rate density.
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Inventors:
ODA, Tomoya (6-3 Otemachi 2-chome, Chiyoda-k, Tokyo 71, 1008071, JP)
Application Number:
JP2007/065320
Publication Date:
February 21, 2008
Filing Date:
July 31, 2007
Export Citation:
Assignee:
NIPPON STEEL CORPORATION (6-3 Otemachi 2-chome, Chiyoda-ku Tokyo, 71, 1008071, JP)
新日本製鐵株式会社 (〒71 東京都千代田区大手町二丁目６番３号 Tokyo, 1008071, JP)
新日本製鐵株式会社 (〒71 東京都千代田区大手町二丁目６番３号 Tokyo, 1008071, JP)
International Classes:
B21B45/02; C21D1/00; B21B45/02; C21D1/00
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg.5-1, Toranomon 3-chome,Minato-k, Tokyo 23, 1058423, JP)
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