Title:
METHOD FOR CREATING POLISHING RATE RESPONSIVENESS PROFILE OF WORKPIECE, POLISHING METHOD, AND COMPUTER-READABLE RECORDING MEDIUM HAVING PROGRAM STORED THEREON
Document Type and Number:
WIPO Patent Application WO/2022/259913
Kind Code:
A1
Abstract:
The present invention relates to techniques for calculating polishing rate responsiveness with respect to a change in the pressure with which a workpiece used for manufacturing a semiconductor device, such as a wafer, a substrate, or a panel, is pressed against a polishing pad. A method of the present invention comprises: calculating by simulation a pressing-pressure responsiveness profile indicating a distribution of pressing-pressure applied from a workpiece to a polishing pad (2) as the pressing-pressure changes in response to a change of unit pressure in a pressure chamber of a polishing head (7); polishing the workpiece by pressing the workpiece against the polishing pad with the interior of the pressure chamber maintained at a predetermined pressure; creating a polishing rate profile indicating a polishing rate distribution of the workpiece being polished; and creating a polishing rate responsiveness profile on the basis of the pressing-pressure responsiveness profile, the predetermined pressure, and the polishing rate profile.
Inventors:
YAMAKI SATORU (JP)
YAGI KEITA (JP)
CHAUHAN NACHIKETA (JP)
NAKAMURA AKIRA (JP)
YAGI KEITA (JP)
CHAUHAN NACHIKETA (JP)
NAKAMURA AKIRA (JP)
Application Number:
PCT/JP2022/022102
Publication Date:
December 15, 2022
Filing Date:
May 31, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304; B24B37/005; B24B37/12; B24B37/30; B24B49/10; B24B49/12
Foreign References:
| JP2006043873A | 2006-02-16 | |||
| JP2008503356A | 2008-02-07 | |||
| JP2020107784A | 2020-07-09 | |||
| JP2001219369A | 2001-08-14 | |||
| JP2007048862A | 2007-02-22 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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