Title:
METHOD OF CREATING AN RFID TAG WITH SUBSTANTIALLY PROTECTED RIGID ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO2006050362
Kind Code:
A3
Abstract:
An electronic assembly and method for making the same includes a flexible substrate and a protective layer arranged adjacent to one side of the substrate. The protective layer has a first thickness and defines at least one hole. A first electrical component has a second thickness that is less than or equal to the first thickness. The first electrical component is received in the hole in the protective layer.
Inventors:
LAWRENCE DANIEL P (US)
RIGNEY JENNIFER (US)
GIBSON DANIEL (US)
RIGNEY JENNIFER (US)
GIBSON DANIEL (US)
Application Number:
PCT/US2005/039484
Publication Date:
June 15, 2006
Filing Date:
November 01, 2005
Export Citation:
Assignee:
PRECISIA L L C (US)
LAWRENCE DANIEL P (US)
RIGNEY JENNIFER (US)
GIBSON DANIEL (US)
LAWRENCE DANIEL P (US)
RIGNEY JENNIFER (US)
GIBSON DANIEL (US)
International Classes:
G06K19/077; G08B13/24; G09F3/03; H05K1/18; H05K3/30
Domestic Patent References:
| WO1997014112A1 | 1997-04-17 | |||
| WO1992022995A1 | 1992-12-23 |
Foreign References:
| US4695858A | 1987-09-22 | |||
| US6107920A | 2000-08-22 | |||
| EP0615285A2 | 1994-09-14 | |||
| US20050049888A1 | 2005-03-03 |
Other References:
SADAO WATAHIKI ET AL: "NEW PACKAGING TECHNOLOGY OF SUPER SMART CARD", PROCEEDINGS OF THE INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM. NARA, JAPAN, APRIL 26 - 28, 1989, NEW YORK, IEEE, US, vol. SYMP. 6, 26 April 1989 (1989-04-26), pages 101 - 104, XP000077902
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