Title:
METHOD FOR CURING HEAT-CURABLE RESIN COMPOSITION, HEAT-CURABLE RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATED PLATE, RESIN SHEET, PRINTED WIRING BOARD AND SEALING MATERIAL EACH PRODUCED USING SAID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/122911
Kind Code:
A1
Abstract:
In a method for curing a heat-curable resin composition according to the present invention, the heat-curable resin composition comprises a heat-curable resin comprising a benzoxazine compound and a curing accelerator comprising a triazinethiol compound and the heat-curable resin composition is cured by heating.
Inventors:
FUJIWARA HIROAKI
KITAI YUKI
SAITO HIROSUKE
KITAI YUKI
SAITO HIROSUKE
Application Number:
PCT/JP2014/000549
Publication Date:
August 14, 2014
Filing Date:
February 03, 2014
Export Citation:
Assignee:
PANASONIC CORP (JP)
International Classes:
B32B15/08; C08L61/34; B32B27/42; C08J5/24; H01L23/14; H01L23/29; H01L23/31
Foreign References:
JP2009167252A | 2009-07-30 | |||
JP2009167251A | 2009-07-30 | |||
JP2012153755A | 2012-08-16 | |||
JP2009222923A | 2009-10-01 | |||
JP2010070757A | 2010-04-02 | |||
JP2011198844A | 2011-10-06 | |||
JP2010533752A | 2010-10-28 |
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (JP)
Yoshikiyo Nishikawa (JP)
Yoshikiyo Nishikawa (JP)
Download PDF: