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Title:
METHOD FOR CURING HEAT-CURABLE RESIN COMPOSITION, HEAT-CURABLE RESIN COMPOSITION, AND PREPREG, METAL-CLAD LAMINATED PLATE, RESIN SHEET, PRINTED WIRING BOARD AND SEALING MATERIAL EACH PRODUCED USING SAID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2014/122911
Kind Code:
A1
Abstract:
In a method for curing a heat-curable resin composition according to the present invention, the heat-curable resin composition comprises a heat-curable resin comprising a benzoxazine compound and a curing accelerator comprising a triazinethiol compound and the heat-curable resin composition is cured by heating.

Inventors:
FUJIWARA HIROAKI
KITAI YUKI
SAITO HIROSUKE
Application Number:
PCT/JP2014/000549
Publication Date:
August 14, 2014
Filing Date:
February 03, 2014
Export Citation:
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Assignee:
PANASONIC CORP (JP)
International Classes:
B32B15/08; C08L61/34; B32B27/42; C08J5/24; H01L23/14; H01L23/29; H01L23/31
Foreign References:
JP2009167252A2009-07-30
JP2009167251A2009-07-30
JP2012153755A2012-08-16
JP2009222923A2009-10-01
JP2010070757A2010-04-02
JP2011198844A2011-10-06
JP2010533752A2010-10-28
Attorney, Agent or Firm:
NISHIKAWA, Yoshikiyo et al. (JP)
Yoshikiyo Nishikawa (JP)
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