METHOD FOR CUTTING BRITTLE MATERIAL SUBSTRATE - MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.

Title:

METHOD FOR CUTTING BRITTLE MATERIAL SUBSTRATE

Document Type and Number:

WIPO Patent Application WO/2010/092964

Kind Code:

A1

Abstract:

In the case of cutting a brittle material substrate in two directions intersecting each other using a laser beam, a first scribe line (52a) composed of a perpendicular crack (53a) and a second scribe line (52b) composed of a perpendicular crack (53b) are formed by radiating a laser beam (LB) and blowing a cooling medium from a cooling nozzle (37) so as to suppress the generation of chipping at the intersection area. The perpendicular crack (53b) is extended by radiating the laser beam (LB) again to the second scribe line (52b), and a substrate (50) is cut at the second scribe line (52b). Then, the perpendicular crack (53a) is extended by radiating the laser beam (LB) again to the first scribe line (52a), and the substrate (50) is cut at the first scribe line (52a). At this time, the maximum width of the radiation width of the radiation spot of the laser beam (LB) radiated again to the first scribe line (52a) is 1.0 mm or less.

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Inventors:

NOBASHI, Kumiko (LTD. 2-12-12 Minami-Kaneden, Suita-cit, Osaka 44, 〒5640044, JP)
野橋　久美子 (〒44 大阪府吹田市南金田２丁目１２番１２号　三星ダイヤモンド工業株式会社内 Osaka, 〒5640044, JP)
YAMAMOTO, Kouji (LTD. 2-12-12 Minami-Kaneden, Suita-cit, Osaka 44, 〒5640044, JP)
山本　幸司 (〒44 大阪府吹田市南金田２丁目１２番１２号　三星ダイヤモンド工業株式会社内 Osaka, 〒5640044, JP)

Application Number:

JP2010/051918

Publication Date:

August 19, 2010

Filing Date:

February 10, 2010

Export Citation:

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Assignee:

MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. (2-12-12, Minami-Kaneden Suita-cit, Osaka 44, 〒5640044, JP)
三星ダイヤモンド工業株式会社 (〒44 大阪府吹田市南金田２丁目１２番１２号 Osaka, 〒5640044, JP)
NOBASHI, Kumiko (LTD. 2-12-12 Minami-Kaneden, Suita-cit, Osaka 44, 〒5640044, JP)
野橋　久美子 (〒44 大阪府吹田市南金田２丁目１２番１２号　三星ダイヤモンド工業株式会社内 Osaka, 〒5640044, JP)
YAMAMOTO, Kouji (LTD. 2-12-12 Minami-Kaneden, Suita-cit, Osaka 44, 〒5640044, JP)

International Classes:

B28D5/00; B23K26/073; B23K26/14; B23K26/38; C03B33/09

Attorney, Agent or Firm:

KASHIMA, Yoshio (409 Yuni Higashi-Umeda 7-2, Minami Ogi-machi, Kita-ku, Osaka-cit, Osaka 52, 〒5300052, JP)

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