Title:
METHOD FOR CUTTING BRITTLE-MATERIAL SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2015/151755
Kind Code:
A1
Abstract:
A cutting edge (51) is pressed against a brittle-material substrate (4) so that a protruding part (PP) of the cutting edge (51) is arranged between a first edge (ED1) of the brittle-material substrate (4) and the side part (PS) of the cutting edge (51) and so that the side part (PS) of the cutting edge (51) is arranged between the protruding part (PP) of the cutting edge (51) and a second edge (ED2) of the brittle-material substrate (4). A scribe line is formed by scratching on the brittle-material substrate (4) between a first position closer to the first edge (ED1) of the first and second edges (ED1, ED2) and a second position closer to the second edge (ED2) of the first and second edges (ED1, ED2). After the scribe line has been formed, a crack line is formed by extending a crack in the direction of thickness (DT) from the second position to the first position along the scribe line.
Inventors:
SOYAMA HIROSHI (JP)
Application Number:
PCT/JP2015/057316
Publication Date:
October 08, 2015
Filing Date:
March 12, 2015
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
International Classes:
B28D5/00; C03B33/10
Domestic Patent References:
| WO2009128334A1 | 2009-10-22 |
Foreign References:
| JP2009208237A | 2009-09-17 | |||
| JP2011054709A | 2011-03-17 |
Other References:
See also references of EP 3127673A4
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Hidetoshi Yoshitake (JP)
Hidetoshi Yoshitake (JP)
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