Title:
METHOD FOR CUTTING BRITTLE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2016/047317
Kind Code:
A1
Abstract:
In the present invention, the tip of a blade is pressed against the surface (SF) of a brittle substrate (4). The pressed tip of the blade is slid along the surface (SF) of the brittle substrate (4) to cause plastic deformation on the surface (SF) of the brittle substrate (4), and thereby a trench line (TL) having a groove shape is formed. The step for forming the trench line (TL) is performed so as to obtain a crackless state, where the brittle substrate (4) is continuous in a direction that intersects the trench line (TL) directly below the trench line (TL). The trench line (TL) includes a curved portion. By stretching a crack of the brittle substrate (4) in the thickness direction along the trench line (TL), a crack line (CL) is formed. Because of the crack line (CL), the continuity of the brittle substrate (4) is interrupted in the direction that intersects the trench line (TL) directly below the trench line (TL).
Inventors:
SOYAMA HIROSHI (JP)
Application Number:
PCT/JP2015/073100
Publication Date:
March 31, 2016
Filing Date:
August 18, 2015
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
International Classes:
C03B33/04; B28D5/00
Foreign References:
| JP2004359502A | 2004-12-24 | |||
| JP2004189556A | 2004-07-08 | |||
| JP2010126383A | 2010-06-10 | |||
| JP2010126387A | 2010-06-10 |
Other References:
See also references of EP 3199499A4
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
Hidetoshi Yoshitake (JP)
Hidetoshi Yoshitake (JP)
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