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Title:
METHOD FOR CUTTING GLASS SHEET
Document Type and Number:
WIPO Patent Application WO/2011/155314
Kind Code:
A1
Abstract:
Provided is a method for cutting a glass sheet, which makes it possible to perform cutting appropriately even for a thin glass sheet having a thickness of 1 mm or less. A scribe line (20a) is formed along part of a planned cutting line (L) on a glass sheet (20). A jig (10) has a surface (10a) in which an uneven section (10b) having a shape corresponding to the planned cutting line (L) is formed, and the glass sheet (20) is placed on the surface (10a). The portion of the glass sheet (20) positioned above the uneven section (10b) is deformed and a crack is developed, with the scribe line (20a) as the origin thereof, to thereby cut the glass sheet (20).

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Inventors:
SAITOH TAKAYOSHI (JP)
Application Number:
PCT/JP2011/061795
Publication Date:
December 15, 2011
Filing Date:
May 24, 2011
Export Citation:
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Assignee:
NIPPON ELECTRIC GLASS CO (JP)
SAITOH TAKAYOSHI (JP)
International Classes:
C03B33/03; B28D5/00; C03B33/023; C03B33/04
Domestic Patent References:
WO2003082542A12003-10-09
Foreign References:
JP2001002438A2001-01-09
JPH09278469A1997-10-28
JPH09141646A1997-06-03
JP2007191352A2007-08-02
JP2011026136A2011-02-10
JP2008019102A2008-01-31
JP2009242184A2009-10-22
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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Claims:



 
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