Title:
METHOD OF CUTTING GLASS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/186693
Kind Code:
A1
Abstract:
The present invention relates to a method of cutting a glass substrate (10) which has a plurality of cavities (60) formed on one surface thereof. A lower surface (58) on which the cavities (60) are formed of the glass substrate (10) which is to be cut is bonded to an upper surface (14a) of a fixed substrate (14) that is formed from a material having a Young's modulus that is equal to or higher than the Young's modulus of the glass substrate (10), and the glass substrate (10) is cut using a dicing device (100).
Inventors:
KIKUCHI YOSHIO (JP)
SHIBATA HIROYUKI (JP)
SHIBATA HIROYUKI (JP)
Application Number:
PCT/JP2018/012416
Publication Date:
October 03, 2019
Filing Date:
March 27, 2018
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
C03B33/03; H01L33/52; H01L23/02; H01L23/08
Foreign References:
| JP2012209617A | 2012-10-25 | |||
| JP2015027671A | 2015-02-12 | |||
| JP2011019033A | 2011-01-27 | |||
| JP2011087272A | 2011-04-28 | |||
| JP2011121817A | 2011-06-23 | |||
| JP2011137896A | 2011-07-14 |
Attorney, Agent or Firm:
CHIBA Yoshihiro et al. (JP)
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