Title:
METHOD FOR CUTTING AND METHOD FOR MANUFACTURING LAMINATE FILM
Document Type and Number:
WIPO Patent Application WO/2019/112000
Kind Code:
A1
Abstract:
This method for cutting a laminate film is a method for cutting a laminate film (FX) in which the laminate film (FX) obtained by laminating a plurality of resin layers (S3, S5, S4) of different materials, is cut along a cutting line (C), the plurality of resin layers (S3, S5, S4) being cut by scanning the cutting line (C) of the laminate film (FX) with a plurality of laser beams (L1, L2) having different wavelengths. Specifically, among the plurality of resin layers (S3, S5, S4), the resin layers (S4, S5) that exhibits photodegradation reaction by absorbing the first laser beam (L1) are cut with the first laser beam (L1), and, among the plurality of resin layers (S3, S5, S4), the resin layer (S3) that exhibits photodegradation reaction by absorbing the second laser beam (L2) is cut with the second laser beam (L2).
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Inventors:
MATSUMOTO RIKIYA (JP)
Application Number:
PCT/JP2018/044899
Publication Date:
June 13, 2019
Filing Date:
December 06, 2018
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
B23K26/38
Domestic Patent References:
| WO2011016572A1 | 2011-02-10 |
Foreign References:
| JPH0810970A | 1996-01-16 | |||
| JP2017531813A | 2017-10-26 |
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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