Title:
METHOD FOR CUTTING NON-ALKALI PLATE GLASS, METHOD FOR CUTTING DISPLAY PANEL, METHOD FOR PRODUCING NON-ALKALI PLATE GLASS, AND METHOD FOR PRODUCING DISPLAY PANEL
Document Type and Number:
WIPO Patent Application WO/2016/021564
Kind Code:
A1
Abstract:
Provided is a method for cutting non-alkali plate glass, wherein the non-alkali plate glass has a B2O3 content (C) of 0-8.5 mass% and a plate thickness (T) of 0.05-0.30mm, and using a specific cutter wheel on the surface of the non-alkali plate glass, a cutting line is made by scribing, and tensile stress or bending stress is applied to this cutting line, thereby cutting the non-alkali plate glass. Good cutting results can be achieved using the method for cutting non-alkali plate glass of the present invention.
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Inventors:
TANAKA HIROKI (JP)
TOKUNAGA HIROFUMI (JP)
ONO KAZUTAKA (JP)
TOKUNAGA HIROFUMI (JP)
ONO KAZUTAKA (JP)
Application Number:
PCT/JP2015/071996
Publication Date:
February 11, 2016
Filing Date:
August 03, 2015
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
C03B33/10; B28D5/00; G09F9/00
Domestic Patent References:
| WO2005072926A1 | 2005-08-11 | |||
| WO2015022873A1 | 2015-02-19 |
Foreign References:
| JP2013112534A | 2013-06-10 | |||
| JP2013173653A | 2013-09-05 | |||
| JPH09188534A | 1997-07-22 |
Attorney, Agent or Firm:
Eikoh Patent Firm, P. C. et al. (JP)
Patent business corporation glory patent firm (JP)
Patent business corporation glory patent firm (JP)
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