Title:
METHOD FOR CUTTING PLATE GLASS
Document Type and Number:
WIPO Patent Application WO/2014/103624
Kind Code:
A1
Abstract:
A method according to the present invention comprises a cutting step of laser cutting a plate glass (G) in the vicinity of a line to be cut (X) and in a manner parallel to the line to be cut (X) so as to form a tensile stress area (W) at positions along the line to be cut (X), and an initial crack forming step of forming an initial crack (C) at an intersection between the line to be cut (X) and an end part (Gs) of the plate glass (G), wherein prior to the execution of the cutting step, a processing step is performed on the end part (Gs) of the plate glass (G) including the line to be cut (X) to prevent cuts that naturally occur due to tensile stress during laser cutting.
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Inventors:
FUJII TAKAHIDE (JP)
INAYAMA NAOTOSHI (JP)
INAYAMA NAOTOSHI (JP)
Application Number:
PCT/JP2013/082427
Publication Date:
July 03, 2014
Filing Date:
December 03, 2013
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO (JP)
International Classes:
C03B33/08; B23K26/38; B23K26/40; C03B33/09
Foreign References:
| JP2012526721A | 2012-11-01 | |||
| JP2007319893A | 2007-12-13 |
Attorney, Agent or Firm:
SHIROMURA Kunihiko et al. (JP)
Kunihiko Shiromura (JP)
Kunihiko Shiromura (JP)
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