Title:
METHOD FOR CUTTING POLARIZING PLATE AND POLARIZING PLATE CUT BY SAID METHOD
Document Type and Number:
WIPO Patent Application WO/2012/014639
Kind Code:
A1
Abstract:
Disclosed is a method that, in the cutting of a polarizing plate using laser light, cuts a polarizing plate, which contains a layer that is a film having an average rate of absorption of laser light in the emission wavelength range of the radiated laser light of no more than 2%, without causing deformation of the cut surface. The method cuts a polarizing plate, which contains a layer that is a film having an average rate of absorption of laser light in the emission wavelength range of the radiated laser light of no more than 2%, and said method contains: a groove-forming step that forms a groove in the abovementioned film by means of radiating laser light having a regulated output and/or rate of traversing; and a tearing step that tears the abovementioned polarizing plate along the abovementioned groove after the abovementioned groove-forming step while regulating the tearing angle and the tension applied to the polarizing plate.
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Inventors:
OIKAWA, Shin (())
及川 伸 (())
及川 伸 (())
Application Number:
JP2011/065369
Publication Date:
February 02, 2012
Filing Date:
July 05, 2011
Export Citation:
Assignee:
SUMITOMO CHEMICAL COMPANY, LIMITED (27-1, Shinkawa 2-chome Chuo-k, Tokyo 60, 〒1048260, JP)
住友化学株式会社 (〒60 東京都中央区新川二丁目２７番１号 Tokyo, 〒1048260, JP)
OIKAWA, Shin (())
住友化学株式会社 (〒60 東京都中央区新川二丁目２７番１号 Tokyo, 〒1048260, JP)
OIKAWA, Shin (())
International Classes:
B23K26/38; B23K26/00; B23K26/40
Attorney, Agent or Firm:
HASEGAWA, Kazuya et al. (HARAKENZO WORLD PATENT & TRADEMARK, Daiwa Minamimorimachi Building 2-6, Tenjinbashi 2-chome Kita, Kita-ku, Osaka-sh, Osaka 41, 〒5300041, JP)
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Claims: