Title:
METHOD FOR CUTTING PROCESSING TARGET
Document Type and Number:
WIPO Patent Application WO/2011/013549
Kind Code:
A1
Abstract:
A rear surface (1b) of a processing target (1A) and a front surface (10a) of a processing target to be cut (10A) are anodically-bonded, and thus, a crack (17) generated from a melting treatment region (13) in the thickness direction of the processing target to be cut (10A) reaches a front surface (1a) of the processing target (1A) continuously and rarely changing the direction. After the processing targets (1A, 10A) are cut, the processing target (10A) is removed from the processing target (1A) to obtain a chip (19).
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Inventors:
UCHIYAMA Naoki (1126-1 Ichino-cho, Higashi-ku, Hamamatsu-sh, Shizuoka 58, 〒4358558, JP)
内山 直己 (〒58 静岡県浜松市東区市野町１１２６番地の１ 浜松ホトニクス株式会社内 Shizuoka, 〒4358558, JP)
KAWAGUCHI Daisuke (1126-1 Ichino-cho, Higashi-ku, Hamamatsu-sh, Shizuoka 58, 〒4358558, JP)
内山 直己 (〒58 静岡県浜松市東区市野町１１２６番地の１ 浜松ホトニクス株式会社内 Shizuoka, 〒4358558, JP)
KAWAGUCHI Daisuke (1126-1 Ichino-cho, Higashi-ku, Hamamatsu-sh, Shizuoka 58, 〒4358558, JP)
Application Number:
JP2010/062230
Publication Date:
February 03, 2011
Filing Date:
July 21, 2010
Export Citation:
Assignee:
HAMAMATSU PHOTONICS K.K. (1126-1, Ichino-cho Higashi-ku, Hamamatsu-sh, Shizuoka 58, 〒4358558, JP)
浜松ホトニクス株式会社 (〒58 静岡県浜松市東区市野町１１２６番地の１ Shizuoka, 〒4358558, JP)
UCHIYAMA Naoki (1126-1 Ichino-cho, Higashi-ku, Hamamatsu-sh, Shizuoka 58, 〒4358558, JP)
内山 直己 (〒58 静岡県浜松市東区市野町１１２６番地の１ 浜松ホトニクス株式会社内 Shizuoka, 〒4358558, JP)
浜松ホトニクス株式会社 (〒58 静岡県浜松市東区市野町１１２６番地の１ Shizuoka, 〒4358558, JP)
UCHIYAMA Naoki (1126-1 Ichino-cho, Higashi-ku, Hamamatsu-sh, Shizuoka 58, 〒4358558, JP)
内山 直己 (〒58 静岡県浜松市東区市野町１１２６番地の１ 浜松ホトニクス株式会社内 Shizuoka, 〒4358558, JP)
International Classes:
B28D5/00; B23K26/00; B23K26/38; C03B33/09; H01L21/301
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA 9th fl. 1-1, Marunouchi 2-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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