Title:
METHOD FOR CUTTING RUNNING GATE OFF OF INJECTION-MOLDED PART
Document Type and Number:
WIPO Patent Application WO/2020/088181
Kind Code:
A1
Abstract:
Disclosed is a method for cutting a running gate (3) off of an injection-molded part. The method comprises determining a position of connection of the injection-molded part with the running gate (3); and performing laser cutting at the position of connection by means of a laser light source (5) outside the injection-molded part, the laser being obliquely directed at the position of connection at a predetermined angle. During the laser cutting, the external laser light (5) cuts along the interface of the injection-molded part and the running gate (3), thus cutting the running gate (3) off of the injection-molded part at the position of connection. In the method, the laser light source (5) cuts in an oblique direction instead of in a vertical direction as in the prior art. In this way, the external laser light source (5) can cut along the interface of the injection-molded part and the running gate (3) to completely cut the running gate (3) off of the injection-molded part, thus avoiding leaving a residual running gate piece (6) on the injection-molded part.
Inventors:
XU ZENGQIANG (CN)
FU YANGFAN (CN)
FU YANGFAN (CN)
Application Number:
PCT/CN2019/108990
Publication Date:
May 07, 2020
Filing Date:
September 29, 2019
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
B29C45/38
Domestic Patent References:
| WO2012013194A1 | 2012-02-02 |
Foreign References:
| CN109571882A | 2019-04-05 | |||
| CN206543951U | 2017-10-10 | |||
| CN104465414A | 2015-03-25 | |||
| CN204545725U | 2015-08-12 | |||
| CN101274480A | 2008-10-01 | |||
| JPH02113922A | 1990-04-26 |
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