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Title:
METHOD FOR CUTTING SHEET LAMINATE AND CUTTING DEVICE THEREOF, OPTICAL SHEET LAMINATE, AND BACKLIGHT UNIT USING IT
Document Type and Number:
WIPO Patent Application WO/2010/044463
Kind Code:
A1
Abstract:
Provided is a production method and a production device which can cut an optical sheet laminate (21) free from interlayer bonding by means of a knife edge without disturbing the position of the optical sheet laminate (21).  After passing between a supporting roller (50) and a retaining roller (52), a carrier (35) having a punched optical sheet laminate (21) is wound around a folded roller (51) having the advancing direction thereof changed slightly and then carried.  The optical sheet laminate (21) is separated from the carrier (35) near the outlet of the supporting roller (50) having the advancing direction thereof changed slightly.  The sheet laminate is cut while a change in the advancing direction is reduced and thereby the amount of distortion, due to the difference between the inner and outer circumferences which is generated by winding around the supporting roller, is reduced, and an easy-to-take-out state is brought about by increasing the winding angle when the sheet laminate is taken out, whereby the optical sheet laminate (21) can be cut stably without disturbing the position of the sheet laminate.

Inventors:
TADERA, Takamitsu (())
Application Number:
JP2009/067914
Publication Date:
April 22, 2010
Filing Date:
October 16, 2009
Export Citation:
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Assignee:
SHARP KABUSHIKI KAISHA (22-22, Nagaike-cho Abeno-ku, Osaka-sh, Osaka 22, 〒5458522, JP)
シャープ株式会社 (〒22 大阪府大阪市阿倍野区長池町22番22号 Osaka, 〒5458522, JP)
International Classes:
B26D7/18; G02F1/13357; G09F9/00
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (Daiwa Minamimorimachi Building, 2-6 Tenjinbashi 2-chome Kita, Kita-ku, Osaka-sh, Osaka 41, 〒5300041, JP)
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