Title:
METHOD FOR CUTTING TEMPERED GLASS PLATE
Document Type and Number:
WIPO Patent Application WO/2014/010490
Kind Code:
A1
Abstract:
Provided is a cutting method using laser light irradiation for a tempered glass plate provided with: an obverse surface layer and a revere surface layer having a residual compressive stress; and an intermediate layer formed therebetween having an internal residual tensile stress (CT) (MPa). The strain energy (UCT) represented by UCT = {CT2×(t1-2×DOL)}/(2×Y) using the obverse surface layer and reverse surface layer thickness (DOL) (μm), the tempered glass plate thickness (t1) (μm), and the Young's modulus (Y) (MPa) is at least 2.5 J/m2, and the cutting index (K) represented by K = Pe/v×exp(-α×t2)×(Y×αL)/(t2×ρ×c) using the laser light output (Pe) (W) radiated to the tempered glass plate, the scanning speed (v) (mm/s), the absorption coefficient (α) (mm-1) of the tempered glass plate with respect to the laser light, and the tempered glass plate thickness (t2) (mm), coefficient of linear expansion (αL) (K-1), density (ρ) (g/mm3), and specific heat (c) (J/g/K) is no greater than 150 N/mm.
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Inventors:
SAITO ISAO (JP)
Application Number:
PCT/JP2013/068290
Publication Date:
January 16, 2014
Filing Date:
July 03, 2013
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
C03B33/09; B23K26/38; B23K26/40
Foreign References:
| JP2006137169A | 2006-06-01 | |||
| JP2006256944A | 2006-09-28 | |||
| JP2008247038A | 2008-10-16 |
Attorney, Agent or Firm:
HAMADA Yuriko et al. (JP)
Yuriko Hamada (JP)
Yuriko Hamada (JP)
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