Title:
METHOD FOR CUTTING WORK
Document Type and Number:
WIPO Patent Application WO/2010/001529
Kind Code:
A1
Abstract:
Provided is a method for cutting a work into the shape of a wafer by pressing a cylindrical work held by a work holder against a wire array formed of wires wound spirally between a plurality of wire guides and then running the wires while supplying slurry to the contact portion of the work and the wires. The work is cut by inclining the axial direction of the work relative to a plane formed by the wire array such that the side away from the plane of the wire array is on the side of a wire guide extending in the axial direction. A method for cutting the work precisely by means of a wire saw to produce a wafer having a good warping shape is thereby provided.
More Like This:
| JP01183313 | SAMPLE CUTTER |
| JP02274460 | CUTTING SPEED CONTROL METHOD AND DEVICE FOR WIRE CUTTER |
| JP55157425 | METHOD OF CUTTING-OFF |
Inventors:
KITAGAWA, Koji (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
北川幸司 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 半導体白河研究所内 Fukushima, 〒9618061, JP)
北川幸司 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 半導体白河研究所内 Fukushima, 〒9618061, JP)
Application Number:
JP2009/002516
Publication Date:
January 07, 2010
Filing Date:
June 04, 2009
Export Citation:
Assignee:
Shin-Etsu Handotai Co.,Ltd. (6-2 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目６番２号 Tokyo, 〒1000004, JP)
KITAGAWA, Koji (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目６番２号 Tokyo, 〒1000004, JP)
KITAGAWA, Koji (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
International Classes:
B24B27/06; B28D5/04
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
Download PDF: