Title:
METHOD OF CUTTING WORKPIECE WITH WIRE SAW, AND WIRE SAW
Document Type and Number:
WIPO Patent Application WO/2011/096018
Kind Code:
A1
Abstract:
Provided is a method of cutting a workpiece efficiently and with high accuracy in such a way that by using tension adjusting devices, only the tension in the portion of the wire on the winding side is effectively reduced, said tension adjusting devices serving to approximate the tension on a wire in a wire saw to a predetermined target tension. This method comprises an advance drive cutting process wherein a workpiece (28) is cut while a wire (W) is being advanced; a first switching process for reversing a wire (W) driving method; a moving-back drive cutting process wherein the workpiece (28) is cut while the wire (W) is being moved back; and a second switching process for reversing the wire (W) driving direction, thereby returning the operation to the advance drive cutting process. These processes are repeated in sequence. In both of the cutting processes, only the tension in the portion of the wire on the winding side is reduced by tension manipulating devices (18A, 18B). Reduction in the target wire tension for that purpose is made after deceleration of wire (W) is completed in the switching processes.
Inventors:
OHYA, Jun (3-38, Ujina-higashi 5-chome, Minami-ku, Hiroshima-sh, Hiroshima 01, 〒7348501, JP)
大矢純 (〒01 広島県広島市南区宇品東５丁目３番３８号トーヨーエイテック株式会社内 Hiroshima, 〒7348501, JP)
HAMASAKI, Tatsumi (3-38, Ujina-higashi 5-chome, Minami-ku, Hiroshima-sh, Hiroshima 01, 〒7348501, JP)
濱崎辰己 (〒01 広島県広島市南区宇品東５丁目３番３８号トーヨーエイテック株式会社内 Hiroshima, 〒7348501, JP)
大矢純 (〒01 広島県広島市南区宇品東５丁目３番３８号トーヨーエイテック株式会社内 Hiroshima, 〒7348501, JP)
HAMASAKI, Tatsumi (3-38, Ujina-higashi 5-chome, Minami-ku, Hiroshima-sh, Hiroshima 01, 〒7348501, JP)
濱崎辰己 (〒01 広島県広島市南区宇品東５丁目３番３８号トーヨーエイテック株式会社内 Hiroshima, 〒7348501, JP)
Application Number:
JP2010/000751
Publication Date:
August 11, 2011
Filing Date:
February 08, 2010
Export Citation:
Assignee:
TOYO ADVANCED TECHNOLOGIES CO., LTD. (3-38, Ujina-higashi 5-chome Minami-ku, Hiroshima-sh, Hiroshima 01, 〒7348501, JP)
トーヨーエイテック株式会社 (〒01 広島県広島市南区宇品東５丁目３番３８号 Hiroshima, 〒7348501, JP)
OHYA, Jun (3-38, Ujina-higashi 5-chome, Minami-ku, Hiroshima-sh, Hiroshima 01, 〒7348501, JP)
大矢純 (〒01 広島県広島市南区宇品東５丁目３番３８号トーヨーエイテック株式会社内 Hiroshima, 〒7348501, JP)
HAMASAKI, Tatsumi (3-38, Ujina-higashi 5-chome, Minami-ku, Hiroshima-sh, Hiroshima 01, 〒7348501, JP)
トーヨーエイテック株式会社 (〒01 広島県広島市南区宇品東５丁目３番３８号 Hiroshima, 〒7348501, JP)
OHYA, Jun (3-38, Ujina-higashi 5-chome, Minami-ku, Hiroshima-sh, Hiroshima 01, 〒7348501, JP)
大矢純 (〒01 広島県広島市南区宇品東５丁目３番３８号トーヨーエイテック株式会社内 Hiroshima, 〒7348501, JP)
HAMASAKI, Tatsumi (3-38, Ujina-higashi 5-chome, Minami-ku, Hiroshima-sh, Hiroshima 01, 〒7348501, JP)
International Classes:
B24B27/06; B28D5/04; H01L21/304
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (Osaka Nakanoshima Builing 2nd Floor, 2-2 Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, 〒5300005, JP)
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