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Title:
METHOD FOR DEPOSITING METAL AND METAL OXIDE FILMS AND PATTERNED FILMS
Document Type and Number:
WIPO Patent Application WO2001083844
Kind Code:
A3
Abstract:
The invention is directed to a photoresist-free method for depositing films composed of metals, such as copper, or its oxides from metal complexes. More specifically, the method involves applying an amorphous film of a metal complex to a substrate. The metal complexes have the formula MfLgXh, wherein M is selected from the group consisting of Ti, V, Cr, Au, Mn, Fe, Co, Ni, Cu, Zn, Si, Sn, Li, Na, K, Ba, Sr, Mo, Ru, Pd, Pt, Re, Ir, and Os, L is a ligand of the formula (R2NCR2'CO) wherein R and R' are independently selected from H, CnHm and CnHmAxBy wherein A and B are independently selected from main group elements and f, g, h, n, m, x and y represent integers and wherein X is an anion independently selected from N3, NCO, NO3, NO2, Cl, Br, I, CN, OH, H and CH3. These films, upon, for example, thermal, photochemical or electron beam irradiation may be converted to the metal or its oxides. By using either directed light or electron beams, this may lead to a patterned metal or metal oxide film in a single step.

Inventors:
HILL ROSS H
SHI YOU MAO
Application Number:
PCT/US2001/013659
Publication Date:
January 16, 2003
Filing Date:
April 27, 2001
Export Citation:
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Assignee:
EKC TECHNOLOGY INC (US)
International Classes:
C22B7/00; C09K13/00; C11D7/32; C11D7/34; C23C18/14; G03F7/42; H01L21/02; H01L21/28; H01L21/311; H01L21/3213; H01L21/768; H05K3/10; H01L21/306; (IPC1-7): C23C18/14
Foreign References:
US5534312A1996-07-09
Other References:
CHUNG ET AL.: "Magnetostructural correlations and catecholase activities of mu-alkoxo-bridged dinuclear copper(II)complexes with 1-diethylaminopropan-2-ol, N3-,NCO- and NO2- ligands", J.CHEM.SOC,DALTON TRANS., 1997, pages 2825 - 2829, XP002211593
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