Title:
METHOD OF DETECTING ABNORMALITY IN LASER BEAM AND LASER MACHINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/261472
Kind Code:
A1
Abstract:
Laser beams that are used in a laser machining device are susceptible to abnormalities due to internal burnout or the like in a laser oscillator. Because such abnormalities often appear in beam diameters or beam profiles before appearing in output reductions, the use of output as an index causes a delay in abnormality detection. The method of detecting an abnormality in a laser beam in a laser machining device provided with a laser oscillator that emits a laser beam comprises: a radiation step for radiating a laser beam to a substrate for changeover adjustment, with the laser beam being defocused from a surface of the substrate for changeover adjustment, the substrate for changeover adjustment being provided outside a machining area loaded with a workpiece that is machined by the laser beam; an imaging step for capturing, using an imaging means, a radiation trace on the substrate for changeover adjustment formed by the radiation step, and acquiring imaging information; and a determination step for determining an abnormality in the laser beam on the basis of the imaging information, wherein each of the steps is performed before determining an output abnormality in the laser beam.
Inventors:
KOBAYASHI NOBUTAKA (JP)
TAKIGAWA YASUHIRO (JP)
SAKA KENTARO (JP)
TAKIGAWA YASUHIRO (JP)
SAKA KENTARO (JP)
Application Number:
PCT/JP2019/025559
Publication Date:
December 30, 2020
Filing Date:
June 27, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/00; B23K26/03
Foreign References:
| JP2008114228A | 2008-05-22 | |||
| JP2004130365A | 2004-04-30 | |||
| JP2011161492A | 2011-08-25 | |||
| JP2012206161A | 2012-10-25 |
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
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