Title:
METHOD FOR DETECTING POOR BONDING PORTION AND INSPECTION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2016/051660
Kind Code:
A1
Abstract:
The present invention is a method for detecting a poor bonding portion in a compound semiconductor chip singulated from a compound semiconductor wafer formed by bonding a first transparent substrate composed of a compound semiconductor having a luminous layer and a second transparent substrate composed of a compound semiconductor. This method is characterized by irradiating the compound semiconductor chip with coaxial epi-illumination light, identifying the color of the light reflected from the poor bonding portion in the compound semiconductor chip, and detecting the poor bonding portion. By doing so, a poor-bonding-portion detection method capable of detecting, with high accuracy, the poor bonding portion at a bonding interface of the compound semiconductor chip singulated from the compound semiconductor wafer formed by directly bonding the two transparent substrates composed of a compound semiconductor is provided.
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Inventors:
HARADA TAKASHI (JP)
Application Number:
PCT/JP2015/004394
Publication Date:
April 07, 2016
Filing Date:
August 31, 2015
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
H01L33/00; G01N21/958
Foreign References:
| JP2009288110A | 2009-12-10 | |||
| JP2013104860A | 2013-05-30 | |||
| JP2014126436A | 2014-07-07 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
Good Miya Mikio (JP)
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