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Patent Searching and Data


Title:
METHOD FOR DETERMINING CUTTING POSITIONS OF OPTICAL FILM
Document Type and Number:
WIPO Patent Application WO/2020/067810
Kind Code:
A1
Abstract:
A method for determining cutting positions of an optical film according to an embodiment of the present invention is a method for determining cutting positions of an optical film, which extends lengthily, so as to enable forming of a plurality of optical film sheet pieces through cutting of the optical film along the widthwise direction thereof while having intervals in the lengthwise direction, and comprises the steps of: (a) informatizing in advance a defective position of the optical film with reference to the lengthwise direction of the optical film; (b) dividing the entire region of the optical film into a plurality of large-section calculation regions for inducing the plurality of cutting positions with reference to a normal cutting interval condition and minimum cutting interval condition of the optical film in the lengthwise direction and defective position information of the optical film; and (c) determining the cutting positions from a region, in which not all the cutting positions have been determined, in the order of the lengthwise direction of the optical film among the plurality of large-section calculation regions.

Inventors:
HEO SOON KI (KR)
KWAK MUN CHEON (KR)
JANG EUNG JIN (KR)
KIM CHAN SOO (KR)
LEE KYU HWANG (KR)
Application Number:
PCT/KR2019/012659
Publication Date:
April 02, 2020
Filing Date:
September 27, 2019
Export Citation:
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Assignee:
LG CHEMICAL LTD (KR)
International Classes:
B26D7/28; B26D5/00; B29D11/00; G02B5/00
Foreign References:
JP4377961B12009-12-02
JPH059898U1993-02-09
KR20160107532A2016-09-19
KR101746294B12017-06-12
US4949607A1990-08-21
Attorney, Agent or Firm:
PCR INTELLECTUAL PROPERTY LAW FIRM (KR)
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