Title:
METHOD AND DEVICE FOR CUTTING, CLEANING, AND DRYING WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2008/075571
Kind Code:
A1
Abstract:
[PROBLEMS] A method and device that, after cutting a workpiece by a cutting robot by
using a high-pressure water, removes chips adhered to a workpiece by using a cleaning
robot and dries the workpiece by a drying robot, in which cleaning efficiency and
drying efficiency are increased to save cleaning water required for cleaning. [MEANS
FOR SOLVING THE PROBLEMS] A step of cutting a workpiece by high-pressure water
and a step of cleaning the workpiece are performed by the cutting robot and cleaning
robot that are controlled according to information on cutting of the workpiece.Such
information is previously inputted in the robots.
Inventors:
HORI SHIMAKI (JP)
Application Number:
PCT/JP2007/073653
Publication Date:
June 26, 2008
Filing Date:
December 07, 2007
Export Citation:
Assignee:
ROSECC CO LTD (JP)
HORI SHIMAKI (JP)
HORI SHIMAKI (JP)
International Classes:
B26D7/18; B08B3/02; B26F3/00
Foreign References:
| JPH11129200A | 1999-05-18 | |||
| JPH1110599A | 1999-01-19 | |||
| JP2006010947A | 2006-01-12 | |||
| JP2006122784A | 2006-05-18 | |||
| JP2006314898A | 2006-11-24 | |||
| JPH0819999A | 1996-01-23 | |||
| JPH08318237A | 1996-12-03 |
Attorney, Agent or Firm:
SUZUKI, Shoji et al. (9th Fl. 10-3, Shinjuku 1-chom, Shinjuku-ku Tokyo 22, JP)
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