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Title:
METHOD AND DEVICE FOR CUTTING STRUCTURE COMPOSED OF BRITTLE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/122570
Kind Code:
A1
Abstract:
One embodiment of the present invention provides a method for cutting a brittle body, comprising the steps of: preparing a brittle body having a rotational shaft; forming, by means of a laser irradiation means, a scribing line by irradiating with a laser along a preset path on the brittle body; and cutting the brittle body by bringing a vibration means for vibrating at a preset frequency into contact with a first area of the brittle body that is spaced apart from the scribing line.

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Inventors:
LEE JOON JUNG (KR)
WON JAE WOONG (KR)
PARK DAE SUNG (KR)
Application Number:
PCT/KR2019/017425
Publication Date:
June 18, 2020
Filing Date:
December 11, 2019
Export Citation:
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Assignee:
MEERE CO INC (KR)
International Classes:
C03B33/033; B23K26/53; C03B33/08; C03B33/09; B23K103/00
Foreign References:
KR101344365B12013-12-24
KR20060081246A2006-07-12
KR20150118312A2015-10-22
KR101431217B12014-08-19
KR20150110707A2015-10-02
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (KR)
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