Title:
METHOD AND DEVICE FOR CUTTING SUBSTRATE BY USING LASER TILTING EMISSION
Document Type and Number:
WIPO Patent Application WO/2017/204386
Kind Code:
A1
Abstract:
The present invention relates to a method and a device for cutting a substrate by using laser tilting emission, and to a method and a device for cutting a substrate by using laser tilting emission, the method and the device allowing a damage layer to be formed, in an inclined direction with respect to the surface of a substrate, in a cut region of the substrate, thereby enabling the substrate to be quickly cut by means of a continuous process.
Inventors:
KANG HYOUNG SHIK (KR)
KIM DAE JIN (KR)
EOM SEUNG HWAN (KR)
GO GUN SUP (KR)
KIM HAN KYU (KR)
LEE SEONG HAN (KR)
KIM DAE JIN (KR)
EOM SEUNG HWAN (KR)
GO GUN SUP (KR)
KIM HAN KYU (KR)
LEE SEONG HAN (KR)
Application Number:
PCT/KR2016/005603
Publication Date:
November 30, 2017
Filing Date:
May 27, 2016
Export Citation:
Assignee:
DNA CO LTD (KR)
KANG HYOUNG SHIK (KR)
KANG HYOUNG SHIK (KR)
International Classes:
H01S3/00; B23K26/38; H01S3/08
Foreign References:
| KR20110047131A | 2011-05-06 | |||
| KR20130133800A | 2013-12-09 | |||
| KR20100107252A | 2010-10-05 | |||
| KR20100007955A | 2010-01-22 | |||
| JP2006110587A | 2006-04-27 |
Attorney, Agent or Firm:
TNI IP LAW FIRM (KR)
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