Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD AND DEVICE FOR CUTTING WITH WIRE SAW
Document Type and Number:
WIPO Patent Application WO/2017/119471
Kind Code:
A1
Abstract:
[Problem] To provide a method for cutting with a wire saw that allows the cutting efficiency to be significantly improved and the work time to be reduced. [Solution] A wire saw obtained by providing a wire with a plurality of cutting beads at prescribed pitches is looped across a plurality of guide pulleys and a driving pulley in an endless manner, and when an object to be cut is cut by moving the wire saw while the wire saw is pressed against the object to be cut, both or one of the pressing force of the cutting beads and the running speed of the wire saw is set or adjusted so that the direction of orientation of a composite vector (C1) obtained by combining the pressing force vector (T1) of the cutting beads (11) and the running speed vector (F1) of the wire saw (10) is directed in a direction approaching the optimum cutting direction vector of the cutting beads.

Inventors:
TANIMOTO, Akiyoshi (1665-2, Higashifuta Ko Iino-ch, Marugame-shi Kagawa 84, 〒7630084, JP)
Application Number:
JP2017/000222
Publication Date:
July 13, 2017
Filing Date:
January 06, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DIATECH INC. (1665-2, Higashifuta Ko Iino-cho, Marugame-sh, Kagawa 84, 〒7630084, JP)
International Classes:
B23D57/02; B23D61/18; B24B27/06
Foreign References:
JP2015136853A2015-07-30
JP2006168226A2006-06-29
JPH09225934A1997-09-02
JP2001300848A2001-10-30
Attorney, Agent or Firm:
ISHII, Hisao (Grandview Shimamoto Building 201, 3-1 Higashinobusue 3-chome, Himeji-sh, Hyogo 65, 〒6700965, JP)
Download PDF: