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Title:
METHOD AND DEVICE FOR FILLING AREAS SITUATED IN HOLLOWS OR BETWEEN TRACKS WITH A VISCOUS PRODUCT ON A PRINTED CIRCUIT BOARD AND EQUIPMENT USING SAID DEVICE
Document Type and Number:
WIPO Patent Application WO2005011877
Kind Code:
A3
Abstract:
The invention relates to a method and device for filling areas located in hollows (4) which do not open out onto the surface of a substrate (1) without a mask or silk screen. According to the invention, said method consists in associating the following objects according to the order of the direction of relative displacement of a head (12) of a filling product (2) in relation to the substrate (1) i.e. a spreading element (10) for the product to be filled (2) on the surface of the substrate (1); an element for displacing (3) the filling product (2) in the area to be filled (4); an element (7) for adjusting the thickness or raking off the excess filling product (2) such that the above-mentioned filling product (2) remains constantly in contact with the area to be filled (4) from the beginning of the filling operation until raking off of the excess product.

Inventors:
BOURRIERES FRANCIS (FR)
KAISER CLEMENT (FR)
CICERO ANTONIO (IT)
NOVELLO OSVALDO (IT)
Application Number:
PCT/FR2004/002043
Publication Date:
April 07, 2005
Filing Date:
July 29, 2004
Export Citation:
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Assignee:
NOVATEC (FR)
BOURRIERES FRANCIS (FR)
KAISER CLEMENT (FR)
CICERO ANTONIO (IT)
NOVELLO OSVALDO (IT)
International Classes:
B05C3/18; H05K3/28; H05K3/40; (IPC1-7): H05K3/28; H05K3/00
Domestic Patent References:
WO2001049422A12001-07-12
Foreign References:
US20020162685A12002-11-07
FR2845858A12004-04-16
US20030057264A12003-03-27
EP1303172A22003-04-16
Other References:
PATENT ABSTRACTS OF JAPAN vol. 018, no. 176 (C - 1183) 25 March 1994 (1994-03-25)
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