METHOD AND DEVICE FOR FIXING A CHIP IN A HOUSING

Title:

METHOD AND DEVICE FOR FIXING A CHIP IN A HOUSING

Document Type and Number:

WIPO Patent Application WO2005041271

Kind Code:

A3

Abstract:

The invention relates to a method and a corresponding device for fixing at least one micromechanical chip in a housing that is optically transparent for radiation of at least one radiation of at least one predetermined cut-off wavelength, wherein an adhesive layer is applied between the chip and the housing and the adhesive layer is irradiated through the housing with the radiation of the cut-off wavelength for hardening purposes.

Inventors:

OFFTERDINGER KLAUS (DE)
LUDWIG RONNY (DE)

Application Number:

PCT/DE2004/002054

Publication Date:

July 21, 2005

Filing Date:

September 15, 2004

Export Citation:

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Assignee:

BOSCH GMBH ROBERT (DE)
OFFTERDINGER KLAUS (DE)
LUDWIG RONNY (DE)

International Classes:

H01L21/52; H01L21/58; H01L23/057; H01L23/08; H01L23/15; H01L23/498; (IPC1-7): H01L23/08; H01L23/15

Foreign References:

US20030010759A1	2003-01-16
US5311402A	1994-05-10
US20020089096A1	2002-07-11

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