Title:
METHOD AND DEVICE FORMING HOLLOW MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2012/008601
Kind Code:
A1
Abstract:
Provided are a method and product for producing a hollow molded product by which a hollow molded product having an extremely thin uniform thickness can be produced easily, efficiently, and stably. Disclosed is a method for producing a hollow molded product comprising a spraying step for forming a resin layer by spraying a liquid resin having a potential difference relative to a die on the inside of the die which can be divided into two or more parts using a spraying tool inserted through a mouth of the die; a solidifying step for solidifying the resin layer; a releasing step for opening the die relative to the spraying tool, and releasing the solidified resin layer from the die while holding the resin layer by the spraying tool; and a removing step for removing the resin layer held by the spraying tool from the spraying tool.
Inventors:
HATAKEYAMA Harumasa (1-5-12, Baraki, Ichikawa-sh, Chiba 04, 〒2720004, JP)
Application Number:
JP2011/066316
Publication Date:
January 19, 2012
Filing Date:
July 19, 2011
Export Citation:
Assignee:
Heiwa Kagaku Industry Co., Ltd. (1-5-12, Baraki Ichikawa-sh, Chiba 04, 〒2720004, JP)
株式会社平和化学工業所 (〒04 千葉県市川市原木１－５－１２ Chiba, 〒2720004, JP)
株式会社平和化学工業所 (〒04 千葉県市川市原木１－５－１２ Chiba, 〒2720004, JP)
International Classes:
B29C41/08; B29L9/00; B29L22/00
Attorney, Agent or Firm:
TSUJII Koichi et al. (NAKAMURA & PARTNERS, Shin-Tokyo Bldg. 3-1, Marunouchi 3-chome, Chiyoda-k, Tokyo 55, 〒1008355, JP)
Claims:
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