METHOD AND DEVICE FOR FORMING OUTER PACKAGE BODY OF PRODUCT

Title:

METHOD AND DEVICE FOR FORMING OUTER PACKAGE BODY OF PRODUCT

Document Type and Number:

WIPO Patent Application WO/2002/033766

Kind Code:

A1

Abstract:

A method of forming the outer package body of a product, comprising the steps of disposing, in a metal mold, a semi-finished product (50) formed of a plurality of components assembled integral with each other and filling a molten resin into the metal mold to cover ,with resin, the peripheral areas of the semi-finished product (50) with the opening parts (34, 35, 36) provided in the semi-finished product (50) at the portions in correspondence with a positive terminal (4), a negative terminal (5), and a temperature detection terminal (6) of the semi-finished product (50), or cover, with resin, the semi-finished product (50) by filling the resin into opening ends provided in outer package cases (51) to (54) to allow the semi-finished product (50) to be inserted therein after the semi-finished product (50) is stored in the outer package cases (51) to (54), whereby the outer package body of the product of thin closed structure can be formed with small size and excellent dustproofness and dripproofness.

Inventors:

IWAIZONO YOSHINORI (JP)
KONISHI SHOJI (JP)
ISHIMARU TAKESHI (JP)

Application Number:

PCT/JP2001/009226

Publication Date:

April 25, 2002

Filing Date:

October 19, 2001

Export Citation:

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Assignee:

MATSUSHITA ELECTRIC IND CO LTD (JP)
IWAIZONO YOSHINORI (JP)
KONISHI SHOJI (JP)
ISHIMARU TAKESHI (JP)

International Classes:

B29C45/14; B29C45/27; B29C70/72; B29C70/88; H01M50/103; H01M50/121; H05K5/00; H01M10/052; (IPC1-7): H01M2/00; H05K5/00

Foreign References:

JPH11289168A	1999-10-19
JPH06196874A	1994-07-15
JP2000260402A	2000-09-22

Other References: