Title:
METHOD AND DEVICE FOR FORMING SOLDER DEPOSITS ON RAISED CONTACT METALLIZATION STRUCTURES
Document Type and Number:
WIPO Patent Application WO/2011/127907
Kind Code:
A3
Abstract:
The invention relates to a method for forming solder deposits (34) on raised contact metallization structures (24) of connection surfaces (23) of a substrate (19) designed in particular as a semiconductor component, wherein wetting surfaces (26) of the contact metallization structures (24) are brought in contact with a solder material layer (15) arranged on a solder material carrier (13), the substrate (19) is heated and the temperature of the solder material layer (15) is controlled at least during the duration of the contact, and subsequently the contact metallization structures (24) wetted with solder material (34) and the solder material layer (15) are separated, thus making it possible to prevent the formation of contact bridges between adjoining contact metallization structures (24) resulting from the surface tension of fused solder material when the wetting surfaces (26) of the contact metallization structures (24) and the solder material layer (15) are separated.
Inventors:
AZDASHT GHASSEM (DE)
Application Number:
PCT/DE2011/000394
Publication Date:
May 31, 2012
Filing Date:
April 13, 2011
Export Citation:
Assignee:
PAC TECH GMBH (DE)
AZDASHT GHASSEM (DE)
AZDASHT GHASSEM (DE)
International Classes:
H01L21/60; B23K3/06; H01L21/683; H01L23/485
Foreign References:
| JPH0621147A | 1994-01-28 | |||
| US20020142516A1 | 2002-10-03 | |||
| JPH08222572A | 1996-08-30 | |||
| JP2008034756A | 2008-02-14 | |||
| JPH09275107A | 1997-10-21 | |||
| US20100105173A1 | 2010-04-29 | |||
| JPH08203904A | 1996-08-09 | |||
| US20080206587A1 | 2008-08-28 | |||
| US6136047A | 2000-10-24 |
Other References:
FON BIH WEN ET AL: "Lead-free Solder Paste Selection and Solder Joint Reliability for Copper Stud Flip Chip", 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING (EMAP 2008); TAIPEI, TAIWAN, 22-24 OCTOBER 2008; [IN CONJUNCTION WITH THE 3RD INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT)]; IEEE, 22 October 2008 (2008-10-22), pages 80 - 83, XP031425302, ISBN: 978-1-4244-3620-0
"Lotpaste", WIKIPEDIA, 23 February 2010 (2010-02-23), XP055017305, Retrieved from the Internet [retrieved on 20120123]
"Lotpaste", WIKIPEDIA, 23 February 2010 (2010-02-23), XP055017305, Retrieved from the Internet
Attorney, Agent or Firm:
TAPPE, Hartmut (Beethovenstrasse 5, Würzburg, DE)
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