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Title:
METHOD AND DEVICE FOR GENERATING CORRECTION LINE INDICATING RELATIONSHIP BETWEEN AMOUNT OF SEPARATION BETWEEN WAFER PATTERN EDGE AND REFERENCE PATTERN EDGE AND REFERENCE PATTERN SPACE WIDTH, AND COMPUTER-READABLE RECORDING MEDIUM
Document Type and Number:
WIPO Patent Application WO/2019/188258
Kind Code:
A1
Abstract:
This method is for generating a correction line indicating the relationship between the amount of separation between a wafer pattern edge and reference pattern edge and the width of a space adjacent to the reference pattern edge. The method includes steps of: creating a frequency-of-appearance graph for the widths of a space adjacent to a reference pattern within a designated area; acquiring a wafer pattern image corresponding to the plurality of space widths shown in the frequency-of-appearance graph; calculating the amounts of separation between a wafer pattern edge and the corresponding reference pattern edge in the image; plotting, on a coordinate system, a plurality of data points specified from the plurality of space widths and the edge separation amounts; and generating a correction line from the plurality of data points on the coordinate system.

Inventors:
KANEKO KOJI (JP)
Application Number:
PCT/JP2019/010046
Publication Date:
October 03, 2019
Filing Date:
March 12, 2019
Export Citation:
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Assignee:
NGR INC (JP)
International Classes:
G01B15/04; G01N23/2251; G06T7/00; H01L21/66
Foreign References:
JPH10171097A1998-06-26
JP2017026880A2017-02-02
JP2016095332A2016-05-26
JP2015059826A2015-03-30
JP2014206466A2014-10-30
JP2018006746A2018-01-11
US20030211398A12003-11-13
US20030046653A12003-03-06
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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