Title:
METHOD AND DEVICE FOR MANUFACTURING CAMERA MODULE, AND METHOD FOR MANUFACTURING OPTICAL MODULE
Document Type and Number:
WIPO Patent Application WO/2020/240968
Kind Code:
A1
Abstract:
The present disclosure provides a device for manufacturing a camera module without requiring furnace equipment, the device making it possible to suppress positional displacement caused by curing shrinkage and uncured portions. A method for manufacturing a camera module according to the present disclosure is characterized by having: a step for applying a delayed-curing UV adhesive (32) to an adhesive application surface (8) of an imaging unit (9) having an imaging element (4) and the adhesive application surface (8); a step for irradiating the delayed-curing UV adhesive (32) applied to the adhesive application surface (8) with a first UV light (51); a step for bonding the imaging unit (9) and a lens unit (3) that has an optical lens by using the delayed-curing UV adhesive (32), which has been irradiated with the first UV light (51); and a step for irradiating the delayed-curing UV adhesive (32) that bonds the lens unit (3) and the imaging unit (9) with a second UV light (52).
Inventors:
SHIMIZU SHUN (JP)
Application Number:
PCT/JP2020/009194
Publication Date:
December 03, 2020
Filing Date:
March 04, 2020
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G03B17/02; G02B7/00; G02B7/02; H04N5/225
Foreign References:
| JP2017200039A | 2017-11-02 | |||
| JP2015143732A | 2015-08-06 | |||
| JP2003296978A | 2003-10-17 |
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
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