Title:
METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/156806
Kind Code:
A1
Abstract:
Provided are a method and a device for manufacturing a semiconductor substrate. The method for manufacturing a semiconductor substrate comprises the following steps: heating a semiconductor material to the molten state for obtaining a molten semiconductor material, thermally spraying the molten semiconductor material onto the substrate by using a thermal spraying gun, then cooling to solidify the molten semiconductor material on the substrate, and finally obtaining the semiconductor substrate. According to the method of the present invention, during the manufacture of the semiconductor substrate, the material utilization rate is high, the manufacturing cost is low, the manufactured semiconductor substrate is large in size, controllable in thickness and high in purity, and the application prospect is wide.
Inventors:
LI GUANGWU (CN)
Application Number:
PCT/CN2016/078658
Publication Date:
September 21, 2017
Filing Date:
April 07, 2016
Export Citation:
Assignee:
LI GUANGWU (CN)
International Classes:
C23C4/12; C23C4/04
Foreign References:
| CN1594624A | 2005-03-16 | |||
| JP2002069654A | 2002-03-08 | |||
| CN1529534A | 2004-09-15 | |||
| US20120279449A1 | 2012-11-08 |
Other References:
See also references of EP 3431626A4
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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