Title:
METHOD AND DEVICE FOR MEASURING THICKNESS OF THIN FILM LAYER USING X-RAYS
Document Type and Number:
WIPO Patent Application WO/2014/065473
Kind Code:
A1
Abstract:
The present invention relates to a method and a device for measuring the thickness of a thin film layer using X-rays. According to the present invention, a calibration curve is determined by comparing a difference in strength between signals scattered by a specific element contained in a base layer of a reference sample having both the base layer and a base layer on which a thin film layer is formed with the thickness of the thin film layer, and a difference in strength between signals scattered by a specific element contained in the reference sample having the base layer and a base layer of a target sample having the base layer on which the thin film layer is formed is compared to the calibration curve such that the thickness of the thin film layer of the target sample is determined.
Inventors:
KIM SHISURK (KR)
KIM JOOHYE (KR)
LEE SANGBONG (KR)
LEE SEONGUK (KR)
KIM JOOHYE (KR)
LEE SANGBONG (KR)
LEE SEONGUK (KR)
Application Number:
PCT/KR2013/001312
Publication Date:
May 01, 2014
Filing Date:
February 20, 2013
Export Citation:
Assignee:
NANO CMS CO LTD (KR)
International Classes:
G01B15/02; G01N23/223
Foreign References:
| JPH08338819A | 1996-12-24 | |||
| KR20040072780A | 2004-08-19 | |||
| JP2002213935A | 2002-07-31 | |||
| JPH10221047A | 1998-08-21 | |||
| KR100721810B1 | 2007-05-25 |
Attorney, Agent or Firm:
JIN, Cheonwoong et al. (KR)
진천웅 (KR)
진천웅 (KR)
Download PDF: