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Patent Searching and Data


Title:
METHOD AND DEVICE FOR POLISHING THROUGH FLOW PASSAGE IN THREE-DIMENSIONAL STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/203948
Kind Code:
A1
Abstract:
Provided is a method for polishing a through flow passage with which it is possible to polish a through flow passage in a three-dimensional structure more appropriately without using a cylinder. In this method, a through flow passage is subjected to a polishing process by causing a polishing fluid including abrasive particles and a liquid to flow through the through flow passage from a sealed container loaded with the polishing fluid. Particularly, in the sealed container, a dispersion process is performed wherein bubbles are created in the polishing fluid to disperse the abrasive particles in the liquid.

Inventors:
WATANABE, Shinya
ABE, Satoshi
TANAKA, Kenichi
UCHINONO, Yoshiyuki
MORI, Mikio
OOHARA, Taketo
MORIMOTO, Masanori
NAKAMURA, Akifumi
Application Number:
JP2017/017168
Publication Date:
November 30, 2017
Filing Date:
May 01, 2017
Export Citation:
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Assignee:
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (1-61, Shiromi 2-chome Chuo-ku, Osaka-sh, Osaka 07, 〒5406207, JP)
International Classes:
B24B31/00
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (AOYAMA & PARTNERS, Umeda Hankyu Bldg. Office Tower 8-1, Kakuda-cho, Kita-ku, Osaka-sh, Osaka 17, 〒5300017, JP)
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