Title:
METHOD AND DEVICE FOR POLISHING WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2012/090366
Kind Code:
A1
Abstract:
This polishing method simultaneously polishes the front and rear surfaces of a workpiece by causing the workpiece to be held by a carrier plate and rotating, while supplying polishing slurry, at least the carrier plate between an upper surface plate and a lower surface plate which have polishing pads adhered thereto, the carrier plate having one or more holding holes for holding the workpiece, at least one of the holding holes being disposed eccentrically. The polishing method is characterized in that the method measures the temperature of the carrier plate and, on the basis of a change in the measured temperature of the carrier plate, controls the amount of polishing of the workpiece (wafer).
Inventors:
OGATA, Shinichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
緒方 晋一 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
TANIMOTO, Ryuichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
緒方 晋一 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
TANIMOTO, Ryuichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
Application Number:
JP2011/005856
Publication Date:
July 05, 2012
Filing Date:
October 19, 2011
Export Citation:
Assignee:
SUMCO CORPORATION (2-1 Shibaura 1-chome, Minato-ku Tokyo, 34, 〒1058634, JP)
株式会社ＳＵＭＣＯ (〒34 東京都港区芝浦一丁目２番１号 Tokyo, 〒1058634, JP)
OGATA, Shinichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
緒方 晋一 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
株式会社ＳＵＭＣＯ (〒34 東京都港区芝浦一丁目２番１号 Tokyo, 〒1058634, JP)
OGATA, Shinichi (2-1 Shibaura 1-chome, Minato-k, Tokyo 34, 〒1058634, JP)
緒方 晋一 (〒34 東京都港区芝浦一丁目２番１号 株式会社ＳＵＭＣＯ内 Tokyo, 〒1058634, JP)
International Classes:
B24B37/00; B24B37/04; B24B49/14; H01L21/304
Attorney, Agent or Firm:
SUGIMURA, Kenji (36F Kasumigaseki Common Gate West, 3-2-1 Kasumigaseki, Chiyoda-k, Tokyo 13, 〒1000013, JP)
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Claims: